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Specifies vocabulary requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. To be read in conjunction with PD ES 59008-1

Cross References: IEC 60068*IEC 61360-1*ISO 9000*ISO/IEC 11179-3*EIA/JESD16*EIA/JESD30-B*EIA/JESD46*EIA/JESD49:1996*EIA/JESD95*ANSI/EIA 554*ANSI/EIA 557*ANSI/EIA 599*IEEE 1029.1*IEEE 1076*FED-STD-209*MIL-STD-883*MIL-PRF-19500*MIL-PRF-38534*ES 59008-1*ISO 8879*IEC 60050*ISO/IEC 10303*EN 100015-1*IEEE 1149.1*IEEE 1364*

Product Details

Published:

12/15/1999

ISBN(s):

0580357589

Number of Pages:

24

File Size:

1 file , 430 KB

Product Code(s):

19978935, 19978935, 19978935

Note:

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