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IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

Product Details

Edition:

1.0

Published:

02/03/2021

Number of Pages:

80

File Size:

1 file , 3.3 MB