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Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

Product Details

Edition:

3.0

Published:

01/10/2008

Number of Pages:

72

File Size:

1 file , 1.1 MB